histeresis - Laser Application

HISTERESIS Company

Hi gh-technology SysTems and Equipment for RESearch, Industry and Science

Laser Applications

Laser cleaning and surface treatments: Marking, deflashing or cleaning are processes related with variable changes of the surface state of a material.
Laser shockwave generation: By measuring the shockwave induced by a high-energy pulsed laser on the surface of a sample, thickness information or detection presence can be accessed.
PLD: Epitaxial method which give an alternative solution to classical processes and allows the growth of oxyde thin films and superlattices.
CARS: Coherent Anti-Stokes Raman Scattering: Caracteristic Raman frequency-shift measurement of high energy laser excited samples. Advantage of the method: to attempt the rota-vibrational structure of the species at ambiant temperature.
CRDS: Cavity Ring Down Spectroscopy: Absorption of a laser beam by a liquid or gas sample in a resonant cavity, to define the chemical composition of simple elements
LIBS: Laser Induced Breakdown Spectroscopy: Qualitative and quantitative non intrusive method based on the analysis of a plasma induced by laser. Applicable on solid, liquid or gas samples.
LIDAR: Light Detection And Ranging: Particle back-scattered laser light is analysed in order to define the atmosphere layers composition in the measurement area.
LIF: Laser Induced Fluorescence: Determination of a solid, liquid or gas sample composition by fluorescence measurement after excitation by a high energy photon (UV - VIS).
Laser marking solutions for OEMs: Direct marking or insulation trough a mask, with a fiber laser or a flashlamp pumped Nd:Yag laser.
Military and space applications: target acquisition, range finding, target designation, collision avoidance, remote sensing, space sensors or secure comunications.
PIV: Particle Image Velocimetry: A non-intrusive optical measurement technique to measure fluid or particle velocity vectors at many points in a flow field simultaneously.
Laser Cutting: Laser cutting is one of the biggest applications of lasers in materials processing. They are used in cutting a variety of materials such as metals, nonmetals and organics. The wavelength, power, beam quality and spot size are some of the parameters that determine the cutting dynamics. Pulsed lasers are used for fine cutting of thin metals and CW lasers are used for cutting wide range of material thickness, as thick as up to 1.5 inches.
Laser Welding: Lasers offer a wide range of welding capabilities such as spot, conduction, penetration and hybrid welding. Laser welding is performed virtually in every industry as it offers numerous benefits such as high welding speeds, short weld cycles, low heat input, low heat affected zone and minimal distortion.
Laser Marking: Laser marking is widely employed on large scale for part identification and traceability. Lasers mark a wide range of materials that include metals, nonmetals, ceramics, plastics, organics, and semiconductors, to name a few. Laser marking is fast and flexible process that can mark alphanumeric, graphics, logos, barcodes and even bitmaps.
Laser Drilling: Laser drilling is a successful manufacturing solution in many industries due to it advantages over using conventional drilling techniques. Advantages include non-contact processing, low heat input into the material, flexibility to drill a wide range of materials, accuracy and consistency.