Nanotechnology


wafer bondingHISTERESIS is able to supply your lab with the best nanotechnology products offering solutions for surface measurements with the Nanovea products (through profilometry, tribology, mechanical testing) and surface analysis (through XPS, UPS, LEED, RHEED, ISS) based on the experience of SPECS.

Also our portfolio is completed by the highest technology in lithography, wafer bonding and photomask processing, adding Suss Microtec products that are able to bring you the solution to your application.


NANOVEA
SUSS MICROTECH
SPECS